| Product No. |
Package Type |
Die Size (With Scribe Lane) |
Scribe Lane |
Back Metal |
Wafer Thickness |
Gate Pad Size |
Die Attach |
Gold Wire |
PDF Files |
| F01N65 |
TO-220 (3 Lead) |
1880μm x 1890μm |
80μm |
Ti / Ni / Ag |
250μm +/-10μm |
266μm x 174μm |
Epoxy |
1 mil |
Click here to download |
| F01N65S |
TO-220 (3 Lead) |
1600μm x 1595μm |
80μm |
Ti / Ni / Ag |
250μm +/-10μm |
266μm x 174μm |
Epoxy |
1 mil |
Click here to download |
| F02N65 |
TO-220 (3 Lead) |
2375μm x 2365μm |
80μm |
Ti / Ni / Ag |
250μm +/-10μm |
266μm x 187μm |
Epoxy |
1 mil |
Click here to download |
| F04N65 |
TO-220F (3 Lead) |
2920μm x 2910μm |
80μm |
Ti / Ni / Ag |
250μm +/-10μm |
370μm x 213μm |
Epoxy |
1 mil |
Click here to download |
| F08N65 |
TO-220 (3 Lead) |
3725μm x 3990μm |
80μm |
Ti / Ni / Ag |
250μm +/-10μm |
526μm x 304μm |
Epoxy |
3 mil |
Click here to download |
| F09N65 |
TO-220 (3 Lead) |
4200μm x 4240μm |
160μm |
Ti / Ni / Ag |
250μm +/-10μm |
526μm x 304μm |
Epoxy |
|
Click here to download |
| F20N50 |
TO-3P (3 Lead) |
5085μm x 5980μm |
80μm |
Ti / Ni / Ag |
250μm +/-10μm |
526μm x 333μm |
Epoxy |
3 mil |
Click here to download |
| Product No. |
Package Type |
Die Size |
|
Back Metal |
Wafer Thickness |
Gate Pad Size |
Gate Bonding Wire |
Source Bonding Wire |
PDF Files |
| C10N65 |
TO-220 (3 Lead) |
4330μm x 5180μm |
| Ti / Ni / Ag |
250μm |
651μm x 355μm |
5 mil x 1 |
15 mil x 6 |
Click here to download |
| F13N50 |
TO-220 (3 Lead) |
4340μm x 5120μm |
|
Ti / Ni / Ag |
250μm |
520μm x 320μm |
5 mil x 1 |
15 mil x 6 |
Click here to download |
| F14N50 |
TO-220 (3 Lead) |
4330μm x 6520μm |
|
Ti / Ni / Ag |
250μm |
520μm x 320μm |
5 mil x 1 |
15 mil x 6 |
Click here to download |
| F14N65 |
TO-220 (3 Lead) |
4330μm x 6520μm |
|
Ti / Ni / Ag |
250μm |
520μm x 320μm |
5 mil x 1 |
15 mil x 6 |
Click here to download |
|